相簿列表 » 桌布下載

訪客 guest 訪客 2011/03/30 18:59

請問可以放上<因與聿案簿錄>第八集的封面圖嗎???><

訪客 guest 訪客 2011/09/12 15:28

請問可以放更多的圖嗎??

訪客 guest 訪客 2012/07/04 22:45

超讚的啦!!!>U<

jean88h dori 2012/07/19 23:49

請問有符文之子的桌布嗎? 謝謝~

訪客 guest 訪客 2012/08/31 17:34

有特傳的桌布嗎?

訪客 guest 訪客 2012/09/13 22:26

我要特傳桌布哈嘶哈嘶哈嘶千冬歲啊啊啊啊－－－－－－嘶－－－－－－－－－－－－－－－－－！！！！！！

訪客 guest 訪客 2012/11/18 16:16

請問可以放特傳的桌布嗎？

翎 guest 翎 2013/02/01 19:36

想要特傳的

訪客 guest 訪客 2013/03/08 13:15

桌布的右下角已經有蓋亞的標示了
可以不要在畫面上又用一個浮水印嗎?
這樣子整個美感都被破壞掉了
覺得好可惜喔!

alesi99 Alesi亞雷希 2013/04/19 23:40

想要千冬歲和夏歲哥的圖啊><

厄摩酉 facebook 厄摩酉 2013/08/17 03:49

建議將幻想小說每一集的封面圖檔與內頁圖檔均PO上供大家欣賞。

Eiei Cheng facebook Eiei Cheng 2014/01/27 18:27

求月與火犬桌圖或桌布
拜託><

i1258i 桐夜 2014/01/27 19:57

沒有懶散的嘛.............

訪客 guest 訪客 2014/01/27 21:12

想要因與聿的封面>___<~~~

訪客 guest 訪客 2014/01/31 19:28

我要第十集夏碎妖豔美圖當桌布OAO

ice25157095 Google+ ice25157095 2016/09/23 18:31

求夜之賢者的桌布

訪客 guest 訪客 2019/12/26 12:07

希望蓋亞可以出「特殊傳說」新版書籍封面+裡面拉頁(彩頁)彙總的畫冊設定集，畢竟書裡的拉頁有摺痕這點在收藏上還是會有些遺憾，如果有那種畫冊總集我想銷量一定會很好的

葉青峻 guest 葉青峻 2021/03/10 10:51

常見的半導體材料有矽、鍺、砷化鎵等
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晶片測試
晶片處理高度有序化的本質增加了對不同處理步驟之間度量方法的需求。晶片測試度量裝置被用於檢驗晶片仍然完好且沒有被前面的處理步驟損壞。如果If the number of dies—the 積體電路s that will eventually become chips—當一塊晶片測量失敗次數超過一個預先設定的閾值時，晶片將被廢棄而非繼續後續的處理製程。
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晶片測試
晶片處理高度有序化的本質增加了對不同處理步驟之間度量方法的需求。晶片測試度量裝置被用於檢驗晶片仍然完好且沒有被前面的處理步驟損壞。如果If the number of dies—the 積體電路s that will eventually become chips—當一塊晶片測量失敗次數超過一個預先設定的閾值時，晶片將被廢棄而非繼續後續的處理製程。

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步驟列表

晶片處理
濕洗
平版照相術
光刻Litho
離子移植IMP
蝕刻（干法蝕刻、濕法蝕刻、電漿蝕刻）
熱處理
快速熱退火Annel
熔爐退火
熱氧化
化學氣相沉積 (CVD)
物理氣相沉積 (PVD)
分子束磊晶 (MBE)
電化學沉積 (ECD)，見電鍍
化學機械平坦化 (CMP)

IC Assembly and Testing 封裝測試
Wafer Testing 晶片測試
Visual Inspection外觀檢測
Wafer Probing電性測試
FrontEnd 封裝前段
Wafer BackGrinding 晶背研磨
Wafer Mount晶圓附膜
Wafer Sawing晶圓切割
Die attachment上片覆晶
Wire bonding焊線
BackEnd 封裝後段
Molding模壓
Post Mold Cure後固化
De-Junk 去節
Plating 電鍍
Marking 列印
Trimform 成形
Lead Scan 檢腳
Final Test 終測
Electrical Test電性測試
Visual Inspection光學測試
Baking 烘烤
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有害材料標誌

許多有毒材料在製造過程中被使用。這些包括：

有毒元素摻雜物比如砷、硼、銻和磷
有毒化合物比如砷化三氫、磷化氫和矽烷
易反應液體、例如過氧化氫、發煙硝酸、硫酸以及氫氟酸

工人直接暴露在這些有毒物質下是致命的。通常IC製造業高度自動化能幫助降低暴露於這一類物品的風險。
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Device yield

Device yield or die yield is the number of working chips or dies on a wafer, given in percentage since the number of chips on a wafer (Die per wafer, DPW) can vary depending on the chips' size and the wafer's diameter. Yield degradation is a reduction in yield, which historically was mainly caused by dust particles, however since the 1990s, yield degradation is mainly caused by process variation, the process itself and by the tools used in chip manufacturing, although dust still remains a problem in many older fabs. Dust particles have an increasing effect on yield as feature sizes are shrunk with newer processes. Automation and the use of mini environments inside of production equipment, FOUPs and SMIFs have enabled a reduction in defects caused by dust particles. Device yield must be kept high to reduce the selling price of the working chips since working chips have to pay for those chips that failed, and to reduce the cost of wafer processing. Yield can also be affected by the design and operation of the fab.

Tight control over contaminants and the production process are necessary to increase yield. Contaminants may be chemical contaminants or be dust particles. "Killer defects" are those caused by dust particles that cause complete failure of the device (such as a transistor). There are also harmless defects. A particle needs to be 1/5 the size of a feature to cause a killer defect. So if a feature is 100 nm across, a particle only needs to be 20 nm across to cause a killer defect. Electrostatic electricity can also affect yield adversely. Chemical contaminants or impurities include heavy metals such as Iron, Copper, Nickel, Zinc, Chromium, Gold, Mercury and Silver, alkali metals such as Sodium, Potassium and Lithium, and elements such as Aluminum, Magnesium, Calcium, Chlorine, Sulfur, Carbon, and Fluorine. It is important for those elements to not remain in contact with the silicon, as they could reduce yield. Chemical mixtures may be used to remove those elements from the silicon; different mixtures are effective against different elements.

Several models are used to estimate yield. Those are Murphy's model, Poisson's model, the binomial model, Moore's model and Seeds' model. There is no universal model; a model has to be chosen based on actual yield distribution (the location of defective chips) For example, Murphy's model assumes that yield loss occurs more at the edges of the wafer (non-working chips are concentrated on the edges of the wafer), Poisson's model assumes that defective dies are spread relatively evenly across the wafer, and Seeds's model assumes that defective dies are clustered together.[25]

Smaller dies cost less to produce (since more fit on a wafer, and wafers are processed and priced as a whole), and can help achieve higher yields since smaller dies have a lower chance of having a defect. However, smaller dies require smaller features to achieve the same functions of larger dies or surpass them, and smaller features require reduced process variation and increased purity (reduced contamination) to maintain high yields. Metrology tools are used to inspect the wafers during the production process and predict yield, so wafers predicted to have too many defects may be scrapped to save on processing costs.[26]

0935811450 guest 0935811450 2022/01/23 08:35

https://drive.google.com/folderview?id=1WHsWeS6LHHFkiM9hEKVcE_3DBbPbyEdQ

查日鵬雄中生 guest 查日鵬雄中生 2022/04/01 10:58

https://affairs.kh.edu.tw/970